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High-throughput, low latency data movement between compute resources (memory included) has become a bottleneck in modern distributed computing workloads such as AI/ML, HPC, and databases. The interconnect fabrics for the two main types of data movement in compute - load store memory access and byte moving I/O - have historically been built and treated disparately. While this made sense when CPU I/O and network interfaces were far lower bandwidth than memory interfaces, their interconnect is now at an architectural merge point. In this keynote, Enfabrica will reveal its blueprint for any-scale, high-bandwidth, latency-tiered memory movement in the data center based on fabrics that blend load store and local DMA primitives (over CXL, PCIe, and similar) with RDMA over network technologies running at 800 Gbps and beyond. We will highlight the efficiencies of such a unified fabric architecture, its ability to render high-throughput memory movement as scalable and hierarchical from chipset to cluster, and its utility as an infrastructure building block that fits seamlessly within existing, robust system software frameworks.

Embedded Memory
Emerging Memories
External Memory
Use Case
Hardware Eng.
Memory Systems Eng.
Systems Architecture

Author:

Shrijeet Mukherjee

Co-Founder & Chief Development Officer
Enfabrica

Shrijeet is a Co-Founder and the Chief Development Officer of Enfabrica. Prior to founding Enfabrica, he was an architect in Google’s infrastructure group. Previously, he was VP Engineering at Cumulus Networks where he built the industry’s first disaggregated Linux-native network operating system. He was the software engineering leader and architect of the industry’s first virtualization/storage offload “smart-NICs” for Cisco UCS. At SGI he was part of the Advanced Graphics team that pioneered floating point framebuffers and programmable shaders. Shrijeet is on the Linux NetDev Society Board of Directors and has over 20 patents. He holds an MS in Computer Science from the University of Oregon.

... read more

Shrijeet Mukherjee

Co-Founder & Chief Development Officer
Enfabrica

Shrijeet is a Co-Founder and the Chief Development Officer of Enfabrica. Prior to founding Enfabrica, he was an architect in Google’s infrastructure group. Previously, he was VP Engineering at Cumulus Networks where he built the industry’s first disaggregated Linux-native network operating system. He was the software engineering leader and architect of the industry’s first virtualization/storage offload “smart-NICs” for Cisco UCS. At SGI he was part of the Advanced Graphics team that pioneered floating point framebuffers and programmable shaders. Shrijeet is on the Linux NetDev Society Board of Directors and has over 20 patents. He holds an MS in Computer Science from the University of Oregon.

 

Shrijeet Mukherjee

Co-Founder & Chief Development Officer
Enfabrica

Shrijeet is a Co-Founder and the Chief Development Officer of Enfabrica. Prior to founding Enfabrica, he was an architect in Google’s infrastructure group. Previously, he was VP Engineering at Cumulus Networks where he built the industry’s first disaggregated Linux-native network operating system. He was the software engineering leader and architect of the industry’s first virtualization/storage offload “smart-NICs” for Cisco UCS. At SGI he was part of the Advanced Graphics team that pioneered floating point framebuffers and programmable shaders.

Read full bio

Shrijeet Mukherjee

Co-Founder & Chief Development Officer
Enfabrica

Shrijeet Mukherjee

Co-Founder & Chief Development Officer
Enfabrica

Shrijeet is a Co-Founder and the Chief Development Officer of Enfabrica. Prior to founding Enfabrica, he was an architect in Google’s infrastructure group. Previously, he was VP Engineering at Cumulus Networks where he built the industry’s first disaggregated Linux-native network operating system. He was the software engineering leader and architect of the industry’s first virtualization/storage offload “smart-NICs” for Cisco UCS. At SGI he was part of the Advanced Graphics team that pioneered floating point framebuffers and programmable shaders. Shrijeet is on the Linux NetDev Society Board of Directors and has over 20 patents. He holds an MS in Computer Science from the University of Oregon.

PETs NA Summit - Sample Attendee List
CXL
Embedded Memory
Emerging Memories
External Memory
Hardware Eng.
Memory Systems Eng.
Systems Architecture

Author:

Debendra Das Sharma

TTF Co-Chair: CXL Consortium & Senior Fellow: Intel
CXL Consortium

Debendra Das Sharma (Senior Member, IEEE) was born in Odisha, India, in 1967. He received the B.Tech. degree (Hons.) in computer science and engineering from IIT Kharagpur, Kharagpur, India, in 1989, and the Ph.D. degree in computer systems engineering from the University of Massachusetts, Amherst, MA, USA, in 1995.,He joined Hewlett-Packard, Roseville, CA, USA, in 1994, and Intel, Santa Clara, CA, USA, in 2001. He is currently an Senior Fellow with Intel. He is responsible for delivering Intel-wide critical interconnect technologies in Peripheral Component Interconnect Express (PCI Express), Compute Express Link (CXL), Universal Chiplet Interconnect Express (UCIe), Coherency Interconnect, Multi-Chip Package Interconnect, and Rack Scale Architecture. He has been leading the development of PCI-Express, CXL, and UCIe inside Intel as well as across the industry since their inception. He holds 160+ U.S. patents and more than 400 patents worldwide.,Dr. Das Sharma has been awarded the Distinguished Alumnus Award by IIT, in 2019, the 2021 IEEE Region 6 Engineer of the Year Award, the PCI-SIG Lifetime Contribution Award in 2022, and the 2022 IEEE CAS Industrial Pioneer Award. He is currently the Chair of UCIe Board, a Director of PCI-SIG Board, and the Chair of the CXL Board

... read more

Debendra Das Sharma

TTF Co-Chair: CXL Consortium & Senior Fellow: Intel
CXL Consortium

Debendra Das Sharma (Senior Member, IEEE) was born in Odisha, India, in 1967. He received the B.Tech. degree (Hons.) in computer science and engineering from IIT Kharagpur, Kharagpur, India, in 1989, and the Ph.D. degree in computer systems engineering from the University of Massachusetts, Amherst, MA, USA, in 1995.,He joined Hewlett-Packard, Roseville, CA, USA, in 1994, and Intel, Santa Clara, CA, USA, in 2001. He is currently an Senior Fellow with Intel. He is responsible for delivering Intel-wide critical interconnect technologies in Peripheral Component Interconnect Express (PCI Express), Compute Express Link (CXL), Universal Chiplet Interconnect Express (UCIe), Coherency Interconnect, Multi-Chip Package Interconnect, and Rack Scale Architecture. He has been leading the development of PCI-Express, CXL, and UCIe inside Intel as well as across the industry since their inception. He holds 160+ U.S. patents and more than 400 patents worldwide.,Dr. Das Sharma has been awarded the Distinguished Alumnus Award by IIT, in 2019, the 2021 IEEE Region 6 Engineer of the Year Award, the PCI-SIG Lifetime Contribution Award in 2022, and the 2022 IEEE CAS Industrial Pioneer Award. He is currently the Chair of UCIe Board, a Director of PCI-SIG Board, and the Chair of the CXL Board

 

Debendra Das Sharma

TTF Co-Chair: CXL Consortium & Senior Fellow: Intel
CXL Consortium

Debendra Das Sharma (Senior Member, IEEE) was born in Odisha, India, in 1967. He received the B.Tech. degree (Hons.) in computer science and engineering from IIT Kharagpur, Kharagpur, India, in 1989, and the Ph.D. degree in computer systems engineering from the University of Massachusetts, Amherst, MA, USA, in 1995.,He joined Hewlett-Packard, Roseville, CA, USA, in 1994, and Intel, Santa Clara, CA, USA, in 2001. He is currently an Senior Fellow with Intel.

Read full bio

Debendra Das Sharma

TTF Co-Chair: CXL Consortium & Senior Fellow: Intel
CXL Consortium

Debendra Das Sharma

TTF Co-Chair: CXL Consortium & Senior Fellow: Intel
CXL Consortium

Debendra Das Sharma (Senior Member, IEEE) was born in Odisha, India, in 1967. He received the B.Tech. degree (Hons.) in computer science and engineering from IIT Kharagpur, Kharagpur, India, in 1989, and the Ph.D. degree in computer systems engineering from the University of Massachusetts, Amherst, MA, USA, in 1995.,He joined Hewlett-Packard, Roseville, CA, USA, in 1994, and Intel, Santa Clara, CA, USA, in 2001. He is currently an Senior Fellow with Intel. He is responsible for delivering Intel-wide critical interconnect technologies in Peripheral Component Interconnect Express (PCI Express), Compute Express Link (CXL), Universal Chiplet Interconnect Express (UCIe), Coherency Interconnect, Multi-Chip Package Interconnect, and Rack Scale Architecture. He has been leading the development of PCI-Express, CXL, and UCIe inside Intel as well as across the industry since their inception. He holds 160+ U.S. patents and more than 400 patents worldwide.,Dr. Das Sharma has been awarded the Distinguished Alumnus Award by IIT, in 2019, the 2021 IEEE Region 6 Engineer of the Year Award, the PCI-SIG Lifetime Contribution Award in 2022, and the 2022 IEEE CAS Industrial Pioneer Award. He is currently the Chair of UCIe Board, a Director of PCI-SIG Board, and the Chair of the CXL Board